ImmerseKool Presents AI Data Center Liquid Cooling Solutions at OCP Korea Tech Day 2026
At OCP Korea Tech Day 2026, held at COEX in Seoul on August 21, 2026, Jun-ho Jang, CEO of ImmerseKool, presented the company’s liquid cooling technologies and solutions for next-generation AI data centers.
The presentation focused on Direct Liquid Cooling (DLC), which is becoming increasingly important as AI servers continue to move toward higher computing density and greater power consumption. ImmerseKool also introduced the key components and technologies required to build reliable liquid cooling infrastructure for high-density AI computing environments.
ImmerseKool develops and supplies a broad range of liquid cooling solutions in collaboration with global technology partners and Korean manufacturers, including Cold Plates, Manifolds, EPDM Hose Assemblies, Stainless Steel Ferrules, Quick Disconnects, CDUs, and Immersion Cooling technologies.
At the event, ImmerseKool showcased CEJN Thermal Management EPDM hoses and Quick Disconnect solutions together with locally manufactured stainless-steel ferrules, demonstrating how global technologies can be combined with Korean manufacturing capabilities to build a stronger and more reliable liquid cooling supply chain.
As AI data center rack density continues to increase, cooling is no longer simply a supporting utility. It is becoming a critical infrastructure technology that directly affects server performance, system reliability, energy efficiency, and overall data center operation.
ImmerseKool’s approach therefore extends beyond supplying individual components. By understanding the complete liquid cooling loop—from Cold Plates and Hoses to Quick Disconnects, Manifolds, and CDUs—the company aims to provide safer, more reliable, and application-oriented cooling solutions for Korea’s rapidly expanding AI infrastructure market.
Through continued collaboration with global technology leaders and Korean manufacturing partners, ImmerseKool will also support the localization of key liquid cooling components and contribute to the development of a more sustainable and competitive AI data center ecosystem in Korea.
ImmerseKool – Cooling Beyond Limits
The presentation focused on Direct Liquid Cooling (DLC), which is becoming increasingly important as AI servers continue to move toward higher computing density and greater power consumption. ImmerseKool also introduced the key components and technologies required to build reliable liquid cooling infrastructure for high-density AI computing environments.
ImmerseKool develops and supplies a broad range of liquid cooling solutions in collaboration with global technology partners and Korean manufacturers, including Cold Plates, Manifolds, EPDM Hose Assemblies, Stainless Steel Ferrules, Quick Disconnects, CDUs, and Immersion Cooling technologies.
At the event, ImmerseKool showcased CEJN Thermal Management EPDM hoses and Quick Disconnect solutions together with locally manufactured stainless-steel ferrules, demonstrating how global technologies can be combined with Korean manufacturing capabilities to build a stronger and more reliable liquid cooling supply chain.
As AI data center rack density continues to increase, cooling is no longer simply a supporting utility. It is becoming a critical infrastructure technology that directly affects server performance, system reliability, energy efficiency, and overall data center operation.
ImmerseKool’s approach therefore extends beyond supplying individual components. By understanding the complete liquid cooling loop—from Cold Plates and Hoses to Quick Disconnects, Manifolds, and CDUs—the company aims to provide safer, more reliable, and application-oriented cooling solutions for Korea’s rapidly expanding AI infrastructure market.
Through continued collaboration with global technology leaders and Korean manufacturing partners, ImmerseKool will also support the localization of key liquid cooling components and contribute to the development of a more sustainable and competitive AI data center ecosystem in Korea.
ImmerseKool – Cooling Beyond Limits