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From EVs to AI Factories: Why NVIDIA Is Moving Toward 800V DC

From EVs to AI Factories: Why NVIDIA Is Moving Toward 800V DC

Date: Aug 17, 2026
The Automotive Industry Has Already Been Through This TransitionOne of the easiest ways to understand NVIDIA's move toward 800V DC AI infrastructure is to look at an industry that …
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Crimp Sleeve Drawings for OCP UQD Hose Barb Couplings Now Available

Crimp Sleeve Drawings for OCP UQD Hose Barb Couplings Now Available

Date: Aug 11, 2026
ImmerseKool has released dedicated crimp sleeve drawings for OCP UQD hose barb couplings to support faster product evaluation and system design. The following technical resources c…
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New Clamp Sleeves for EPDM Hoses

New Clamp Sleeves for EPDM Hoses

Date: Jul 24, 2026
Part No.Outside DiameterGroove Root DiameterInside DiameterLengthGroove AngleChamferMaterialRaw Material SizeIMK-CLAMP02Ø15 mmØ13.3 mmØ12.3 mm15 mm90°C0.3SUS304Ø16 mmIMK-CLAMP04Ø19…
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Robot-Ready Liquid Cooling Hose Kits for the Physical AI Era

Robot-Ready Liquid Cooling Hose Kits for the Physical AI Era

Date: Jul 22, 2026
As liquid cooling expands across AI data centers, hose kits are evolving beyond simple coolant-transfer components. They are becoming critical interfaces that influence installatio…
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IMMERSEKOOL to Exhibit and Present at 2026 OCP Korea Tech Day

IMMERSEKOOL to Exhibit and Present at 2026 OCP Korea Tech Day

Date: Jul 12, 2026
IMMERSEKOOL will participate in the 2026 OCP Korea Tech Day, which will be held on Friday, August 21, 2026, at the Grand Ballroom & ASEM Ballroom, COEX, Seoul, Korea. During th…
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DLC DN08 vs OCP UQDB06 — Flow Performance Comparison

DLC DN08 vs OCP UQDB06 — Flow Performance Comparison

Date: Jul 11, 2026
DLC DN08 (Flat-face dry-break coupling) Nominal flow diameter (DN): DN 8.0 mm Kv (m³/h): 2.54 Cv (US gpm): 2.94 Max allowed flow: 50 L/min Design / function: Flat-face, spill-minim…
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SMARTFLOW vs FD83 — Pros & Cons Summary

SMARTFLOW vs FD83 — Pros & Cons Summary

Date: Jul 11, 2026
SMARTFLOW Key advantages No spill Very quick / easy connection & disconnection In stock / fast delivery Wide range of sizes: 1", 2", 2.5", 3", 4" Considerations Flow rate is at an …
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2026 Data Center Summit Korea

2026 Data Center Summit Korea

Date: May 27, 2026
ImmerseKool will participate in the 2026 Data Center Summit Korea, taking place on Monday, June 1, 2026, at the COEX Grand Ballroom. At this event, ImmerseKool will showcase its so…
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Thank You for Visiting Us at HVAC KOREA 2026

Thank You for Visiting Us at HVAC KOREA 2026

Date: May 19, 2026
Thank you for your interest in IMMERSEKOOL AI Data-Center Liquid Cooling Solution Newsletter Body Dear Customers and Partners, Thank you very much for visiting the IMMERSEKOOL boot…
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NVIDIA H100 – Two-Phase Immersion Boiler Solution

NVIDIA H100 – Two-Phase Immersion Boiler Solution

Date: Apr 24, 2026
We are pleased to introduce the next-generation thermal solution designed for AI data centers and high-performance computing environments: H100 Two-Phase Immersion Boiler Solution …
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High-Performance OCP Liquid Cooling Hose Assemblies

High-Performance OCP Liquid Cooling Hose Assemblies

Date: Apr 08, 2026
Premium EPDM hoses with stainless steel quick connectors — engineered for reliable, leak-free performance in AI data center Direct Liquid Cooling systems. Oxide Cured EPDM Stainles…
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ImmerseKool 3kW Two-Phase Immersion Cooling System

ImmerseKool 3kW Two-Phase Immersion Cooling System

Date: Mar 27, 2026
2-Phase immersion = boiling + condensation cooling Chip heat → instant vaporization → massive heat absorption Pump-free natural circulation Up to 95% more efficient than air coolin…
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EPDM UL 94 V-0 Hose for AI Data Center Liquid Cooling

EPDM UL 94 V-0 Hose for AI Data Center Liquid Cooling

Date: Mar 22, 2026
In AI data centers and semiconductor equipment, performance is defined by thermal management. This EPDM hose, rated UL 94 V-0 for flame resistance, is engineered for DLC (Direct Li…
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ORV3 Server Racks and Quick-Connect Interfaces for AI Data Centers

ORV3 Server Racks and Quick-Connect Interfaces for AI Data Centers

Date: Mar 15, 2026
IMMERSKOOL designs and manufactures advanced infrastructure for next-generation AI data centers. Our solutions include OCP ORV3 server racks and precision-engineered liquid-cooling…
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ImmerseKool Sets a New Standard in AI Data Center Cooling with Single-Phase and Two-Phase Immersion Solutions

ImmerseKool Sets a New Standard in AI Data Center Cooling with Single-Phase and Two-Phase Immersion Solutions

Date: Jan 17, 2026
As high-performance AI computing and high-density GPU environments continue to expand, cooling technology has become a critical factor in data center competitiveness. In response, …
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High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

Date: Jan 10, 2026
To effectively manage the extreme heat generated by AI and high-performance computing (HPC), we provide optimized cold plate solutions. Customized Design: Tailored designs fully co…
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UQD Manifold Supply: Sejong 100kW Edge Data Center

UQD Manifold Supply: Sejong 100kW Edge Data Center

Date: Jan 10, 2026
ImmerseKool has successfully supplied CEJN OCP-standard UQD 02 Series couplings for the liquid cooling server racks at Korea’s largest newly-established AI data center, supporting …
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Release of -100°C Rated Quick Connectors for Quantum Computing

Release of -100°C Rated Quick Connectors for Quantum Computing

Date: Jan 10, 2026
We have launched two types of quick connects for quantum computers. These features tube connections in 3/8" and 3/4" sizes, rated for temperatures between -100°C and -150°C.
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