IMMERSEKOOL
Skip to content
Manufacturing & Supply

Liquid Cooling for AI Data Centers.

We manufacture and supply core components and chambers/equipment for DLC & Immersion.

AI Data Center
Products

Components & Systems

Components support both standard and custom specs; systems are built around your rack/server configuration.

Components
Modules
  • Cold Plate
  • OCP / Custom Manifold
  • Hose (EPDM, etc.)
  • Quick Coupling Modules
  • Heat Sink / Boiler
  • Coolant
Systems
Built-to-order
  • DLC Module (Cold plate)
  • Immersion Chamber (Single Phase)
  • Immersion Chamber (Two Phase)
  • CDU (In-rack / In-row)
  • POC Support Package
News

Latest Updates

High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

High-Performance Cold Plate Solutions for GPU/CPU/Accelerators

Date: Jan 10, 2026
To effectively manage the extreme heat generated by AI and high-performance computing (HPC), we provide optimized cold plate solutions. Customized Design: Tailored designs fully co…
UQD Manifold Supply: Sejong 100kW Edge Data Center

UQD Manifold Supply: Sejong 100kW Edge Data Center

Date: Jan 10, 2026
ImmerseKool has successfully supplied CEJN OCP-standard UQD 02 Series couplings for the liquid cooling server racks at Korea’s largest newly-established AI data center, supporting …
Release of -100°C Rated Quick Connectors for Quantum Computing

Release of -100°C Rated Quick Connectors for Quantum Computing

Date: Jan 10, 2026
We have launched two types of quick connects for quantum computers. These features tube connections in 3/8" and 3/4" sizes, rated for temperatures between -100°C and -150°C.
More news
Contact

Quotation/POC & Product Inquiry

Leave only essential details, and we’ll get back to you quickly.

Your inquiry will be delivered securely via Formspree.
Inquiry checklist
  • Cooling group: DLC 1P / DLC 2P / Immersion 1P / Immersion 2P
  • Heat load (kW) and rack/server layout
  • Interfaces: manifold ports, hose size, coupling type
  • Delivery country / schedule
Fast response

Share basic specs and we can propose an initial BOM and a POC-ready configuration.