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Cold Plate 8 OCP / Custom Manifold 2 Hose (EPDM, etc.) 8 Quick Coupling Modules 11 Heat Sink / Boiler 14 Coolant 4 DLC Module (Cold plate hose kit) 2 Immersion Chamber (Single Phase) 3 Immersion Chamber (Two Phase) 3 CDU (In-rack / In-row) 3 POC Support Package 2
BOILER EGS (Custom Module) BOILER EGS E IMK-BOILER-AMD SP5 BOILER - AMD IMK-BOILER-H100 BOILER-H100 IMK-BOILER-I24147 EDM BOILER-I2414 IMK-BOILER-LGA1700 BOILER-LGA17 IMK-BOILER-RTX 4090 BOILER-RTX 4 IMK-BOILER-RTX 5090 BOILER RTX50 IMK-BOILER-TS9F-intel EGS BOILER-TS9F- IMK-IMM1-AMD SP5 HEAT SINK - IMK-IMM1-EGS HEAT SINK - IMK-IMM1-H100 HEAT SINK - IMK-IMM1-INTEL-Eaglestream HEAT SINK - IMK-IMM1-RTX5090 HSK HEAT SINK NV IMK-IMM1-Xeon W9 3495X HEAT SINK -

Heat Sink / Boiler

Components
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HEAT SINK - Intel Eaglestream2
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IMK-IMM1-INTEL-Eaglestream
HEAT SINK - Intel Eaglestream2
주용도: 1상 액침 냉각(Single-phase Immersion Cooling) 시스템에 사용되는 Intel GPU 전용 냉각 부품입니다

상세내용

  • 항목 (Item)내용 (Description)영어 (English)
    모델명/플랫폼인텔 이글스트림 2 (Eaglestream)Platform: Intel Eaglestream
    냉각 방식1상 액침 냉각Cooling Type: 1-Phase Immersion Cooling
    호환 장치인텔 GPU (데이터센터용 가속기 등)Target Device: Intel GPU (Data Center GPU)
    기본 재질구리 (높은 열전도율 제공)Base Material: Copper
    크기117.878.010.3mm (부속품 제외)Dimension: 117.878.010.3mm (w/o joints)
    질량604 gMass: 604 g
    냉각 성능385W (설계 기준 발열량)Performance: 385W (Heat Dissipation)
    열 저항R-ca = 0.028°C/WThermal Resistance: R-ca = 0.028°C/W