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Cold Plate 9 OCP / Custom Manifold 3 Hose (EPDM, etc.) 9 Quick Coupling Modules 11 Heat Sink / Boiler 14 Coolant 4 DLC Module (Cold plate hose kit) 2 Immersion Chamber (Single Phase) 3 Immersion Chamber (Two Phase) 3 CDU (In-rack / In-row) 4 POC Support Package 2
IMK-BMQC SERIES OCP BMQC SER IMK-DLC-DN3 DLC-DN3 AUTO IMK-DLC-DN8 DLC-DN8 AUTO IMK-DLC-UQD04-KIT DLC-UQD04-KI IMK-FD83 SERIES OCP FD83 SER IMK-LQC SERIES OCP LQC SERI IMK-SMARTFLOW SERIES CEJN SMARTFL IMK-ULTRFLOW SERIES CEJN ULTRFLO IMK-UQD OCP UQD SERI IMK-UQDB SERIES OCP UQDB SER IMMERSEKOOL DLC Hose Kit Platform Server · Rac

Quick Coupling Modules

Components
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OCP UQD SERIES
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IMK-UQD
OCP UQD SERIES
Main Use: OCP UQD(Universal Quick Disconnects) 카플링은 데이터 센터 액체 냉각 시스템을 위한 국제 개방형 표준 퀵 커넥트 솔루션입니다. 인텔(Intel)의 주도로 개발되었으며, 특정 제조사에 구애받지 않고 표준을 준수하는 제품 간의 상호 호환성을 보장하는 것을 목표로 합니다

Details

PropertyItemUnitStandard Value
Standard ComplianceStandard Compliance–OCP UQD Rev 1.0 (Open Standard)
Nominal Flow DiameterNominal Flow Diametermm3.2, 6.4, 9.5, 12.7 (4 sizes available)
Max Working PressureMax Working Pressurebar10 (Up to 16–20 bar by manufacturer)
Operating Temp RangeOperating Temp Range℃-40 ~ +150 (Varies by manufacturer)
Main MaterialMain Material–Stainless Steel (AISI 303/304/316)
Seal MaterialSeal Material–EPDM (Ethylene Propylene Rubber)
Fluid Loss RequirementFluid Loss Requirement–Meets OCP Rev 1.0 specifications (Minimized)
ConfigurationConfiguration–Supports Hand-mate & Blind-mate options