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Cold Plate 9 OCP / Custom Manifold 3 Hose (EPDM, etc.) 9 Quick Coupling Modules 11 Heat Sink / Boiler 14 Coolant 4 DLC Module (Cold plate hose kit) 2 Immersion Chamber (Single Phase) 3 Immersion Chamber (Two Phase) 3 CDU (In-rack / In-row) 4 POC Support Package 2
IMK-BMQC SERIES OCP BMQC SER IMK-DLC-DN3 DLC-DN3 AUTO IMK-DLC-DN8 DLC-DN8 AUTO IMK-DLC-UQD04-KIT DLC-UQD04-KI IMK-FD83 SERIES OCP FD83 SER IMK-LQC SERIES OCP LQC SERI IMK-SMARTFLOW SERIES CEJN SMARTFL IMK-ULTRFLOW SERIES CEJN ULTRFLO IMK-UQD OCP UQD SERI IMK-UQDB SERIES OCP UQDB SER IMMERSEKOOL DLC Hose Kit Platform Server · Rac

Quick Coupling Modules

Components
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DLC-DN8 AUTO COUPLING
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IMK-DLC-DN8
DLC-DN8 AUTO COUPLING
Main Use: 데이터센터 서버, HPC 랙 등에서 서버 CPU/GPU를 직접 액체로 냉각하는 방식입니다. 이를 위해 서버랙에 퀵 커넥트(quick-connect) 카플링이 장착되어 있어, 랙 모듈의 냉각 라인을 쉽고 빠르게 탈부착할 수 있도록 설계됨

Details

Comparison ItemDLC DN08OCP UQDB06
(Flat-face dry-break coupling)(OCP blind-mate quick disconnect)
Nominal Flow Diameter (DN)DN 8.0 mmDN 9.5 mm
Kv (m³/h)2.541.57–1.75
Cv (US gpm)2.941.82–2.02
Maximum Allowable Flow50 L/min—
Design / FunctionFlat-face, minimized spillage, easy manual connectionBlind-mate, OCP-compatible, designed for hot-swap applications
Flow PerformanceHigher Kv/Cv and lower pressure dropRelatively lower Kv/Cv despite the larger DN
Product ApplicationData center and semiconductor liquid coolingData center DLC, particularly OCP-standardized blind-mate connections