Products
Skip to content
Cold Plate 9 OCP / Custom Manifold 3 Hose (EPDM, etc.) 9 Quick Coupling Modules 11 Heat Sink / Boiler 14 Coolant 4 DLC Module (Cold plate hose kit) 2 Immersion Chamber (Single Phase) 3 Immersion Chamber (Two Phase) 3 CDU (In-rack / In-row) 4 POC Support Package 2
BOILER EGS (Custom Module) BOILER EGS E IMK-BOILER-AMD SP5 BOILER - AMD IMK-BOILER-H100 BOILER-H100 IMK-BOILER-I24147 EDM BOILER-I2414 IMK-BOILER-LGA1700 BOILER-LGA17 IMK-BOILER-RTX 4090 BOILER-RTX 4 IMK-BOILER-RTX 5090 BOILER-RTX 5 IMK-BOILER-TS9F-intel EGS BOILER-TS9F- IMK-IMM1-AMD SP5 HEAT SINK - IMK-IMM1-EGS HEAT SINK - IMK-IMM1-H100 HEAT SINK - IMK-IMM1-INTEL-Eaglestream HEAT SINK - IMK-IMM1-RTX5090 HSK NVIDIA RTX50 IMK-IMM1-Xeon W9 3495X HEAT SINK -

Heat Sink / Boiler

Components
Inquiry
BOILER-RTX 5090
Click image to enlarge
IMK-BOILER-RTX 5090
BOILER-RTX 5090
Main Use: Boiler, RTX 5090 immersion cooling

Details

  • The RTX 5090 Boiler is a next-generation Two-Phase Immersion Cooling evaporator
    featuring a Cu base + mesh structure optimized for AI GPUs.

    The high thermal conductivity copper base combined with a mesh surface enhances
    boiling efficiency, delivering low thermal resistance and stable cooling performance
    in ultra-high heat flux environments.


ItemSpecification
ApplicationNVIDIA RTX 5090 GPU
StructureCu Base + Mesh / Microchannel Geometry
MaterialCopper (Cu) + Aluminum Frame
Cooling MethodTwo-Phase Immersion Cooling
Heat TransferPool Boiling (Evaporation)
Dimension130.6 × 80.7 × 11 mm
Weight186 g
SurfaceMesh-enhanced boiling surface
Thermal Resistance (Rth)approx. 0.033 @ 600W (FC18P)
CoolantLow-GWP fluids (e.g., FC-72, FC-40, FC18P)
Application FieldAI Server / HPC / High-Performance GPU